Dual-polarized magneto-electric antenna array

ABSTRACT

A package structure is provided that includes a planar core structure comprising a first side and a second side opposite the first side. The package structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure comprises a plurality of first laminated layers, each first laminated layer comprising a first patterned conductive layer formed on a first insulating layer, an antenna formed on one or more first patterned conductive layers of the first laminated layers, the antenna including at least one L-shaped structure. The package structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feed line structure formed in, and routed through, the interface structure and the planar core structure, wherein the antenna feed line structure is not connected to the planar antenna.

BACKGROUND

The present disclosure relates generally to wireless communicationpackage structures, and, in particular, to techniques for packagingantenna structures with semiconductor RFIC (radio frequency integratedcircuit) chips to form compact integrated radio/wireless communicationssystems for millimeter wave (mm Wave) applications. Specifically, thepresent disclosure relates to dual-polarized magneto-electric antennaarray structures for RFIC package applications.

When constructing wireless communications package structures withintegrated antennas, it may be desirable to implement package designsthat provide proper antenna characteristics (e.g., high efficiency, widebandwidth, good radiation characteristics, etc.), while providing lowcost and reliable package solutions. The integration process requiresthe use of high-precision fabrication technologies so that fine featurescan be implemented in the package structure. Conventional solutions aretypically implemented using complex and costly packaging technologies,which are lossy and/or utilize high dielectric constant materials. Forconsumer applications, high performance package designs with integratedantennas are not typically required. However, for industrialapplications (e.g., 5G cell tower applications), high performanceantenna packages are needed and typically require large phased arrays ofantennas. The ability to design high performance packages with phasedarray antennas is not trivial for millimeter wave operating frequenciesand higher.

One type of antenna design is known as magneto-electric dipole (MED)antenna. In general, a MED antenna includes a magnetic dipole and anelectric dipole. By exciting the complementary dipoles with suitableamplitudes and phases simultaneously, the antenna is able to producegood radiation characteristics over a wide frequency band. MED antennasmay be suitable for certain mobile cellular networks.

Certain antenna designs do not consider the RFIC package environment,such as having many metal layers and any metal layer metal fillrequirements. Also, certain phased array applications may require λ/2wavelength spacing requirements. In certain examples, the antennaperformance may deteriorate in an Antenna-in-Package (AiP) environment.

SUMMARY

Embodiments of the present disclosure relate to a package structure thatincludes a planar core structure comprising a first side and a secondside opposite the first side. The package structure also includes anantenna structure disposed on the first side of the planar corestructure. The antenna structure comprises a plurality of firstlaminated layers, each first laminated layer comprising a firstpatterned conductive layer formed on a first insulating layer, anantenna formed on one or more first patterned conductive layers of thefirst laminated layers, the antenna including at least one L-shapedstructure. The package structure also includes an interface structuredisposed on the second side of the planar core structure, and an antennafeed line structure formed in, and routed through, the interfacestructure and the planar core structure, wherein the antenna feed linestructure is not connected to the planar antenna. This may allow forhigh performance phased array antenna design for wide bandwidth, highhorizontal and vertical port isolation, and stable gain.

In certain embodiments, the antenna includes four of the L-shapedstructures. This may allow for tuning of the high performance phasedarray antenna design by altering certain dimensions of the L-shapedstructures.

In certain embodiments, the L-shaped structures are arranged in asymmetrical manner with corners of the L-shaped structures facinginward. This may further allow for tuning of the high performance phasedarray antenna design by altering certain dimensions of the L-shapedstructures.

In certain embodiments, the package structure further comprises a cagewall structure in the antenna structure, the cage wall surrounding theantenna. In certain embodiments, the cage wall structure is electricallyconnected to the L-shaped structure through a first ground plane layerof the core structure. In certain embodiments, the cage wall structureincludes a plurality of conductive grounded rings that extend verticallythrough the antenna structure. The cage wall structure (or grounded cagewall) may enable enhanced antenna performance in many high precisionpackage processes.

In certain embodiments, an apparatus is provided including a packagestructure comprising a planar core structure comprising a first side anda second side opposite the first side. The package structure alsoincludes an antenna structure disposed on the first side of the planarcore structure. The antenna structure comprises a plurality of firstlaminated layers, each first laminated layer comprising a firstpatterned conductive layer formed on a first insulating layer, anantenna formed on one or more first patterned conductive layers of thefirst laminated layers, the antenna including at least one L-shapedstructure. The package structure also includes an interface structuredisposed on the second side of the planar core structure, and an antennafeed line structure formed in, and routed through, the interfacestructure and the planar core structure, wherein the antenna feed linestructure is not connected to the planar antenna. This may allow forhigh performance phased array antenna design for wide bandwidth, highhorizontal and vertical port isolation, and stable gain. The apparatusalso includes an RFIC (radio frequency integrated circuit) chipcomprising a semiconductor substrate having an active surface and aninactive surface, and a BEOL (back end of line) structure formed on theactive surface of the semiconductor substrate, wherein the RFIC chip ismounted to the package structure by connecting the BEOL structure of theRFIC chip to contact pads of the interface structure. This may allow forhigh performance phased array antenna design for wide bandwidth, highhorizontal and vertical port isolation, and stable gain.

In certain embodiments, the antenna of the apparatus includes four ofthe L-shaped structures. This may allow for tuning of the highperformance phased array antenna design by altering certain dimensionsof the L-shaped structures.

In certain embodiments of the apparatus, the L-shaped structures arearranged in a symmetrical manner with corners of the L-shaped structuresfacing inward. This may further allow for tuning of the high performancephased array antenna design by altering certain dimensions of theL-shaped structures.

In certain embodiments of the apparatus, the package structure furthercomprises a cage wall structure in the antenna structure, the cage wallsurrounding the antenna. In certain embodiments, the cage wall structureis electrically connected to the L-shaped structure through a firstground plane layer of the core structure. In certain embodiments, thecage wall structure includes a plurality of conductive grounded ringsthat extend vertically through the antenna structure. The cage wallstructure (or grounded cage wall) may enable enhanced antennaperformance in many high precision package processes.

Embodiments of the present disclosure relate to a method ofmanufacturing a package structure, the method include forming a planarcore structure comprising a first side and a second side opposite thefirst side. The method also includes forming an antenna structure on thefirst side of the planar core structure, the antenna structurecomprising a plurality of first laminated layers, each first laminatedlayer comprising a first patterned conductive layer formed on a firstinsulating layer, an antenna formed on one or more first patternedconductive layers of the first laminated layers, the antenna includingat least one L-shaped structure. The method also includes forming aninterface structure on the second side of the planar core structure. Themethod also includes forming an antenna feed line structure in, androuted through, the interface structure and the planar core structure,wherein the antenna feed line structure is not connected to the planarantenna. This may allow for high performance phased array antenna designfor wide bandwidth, high horizontal and vertical port isolation, andstable gain.

In certain embodiments of the method of manufacturing the packagestructure, the antenna of the apparatus includes four of the L-shapedstructures. This may allow for tuning of the high performance phasedarray antenna design by altering certain dimensions of the L-shapedstructures.

In certain embodiments of the method of manufacturing the packagestructure, the L-shaped structures are arranged in a symmetrical mannerwith corners of the L-shaped structures facing inward. This may furtherallow for tuning of the high performance phased array antenna design byaltering certain dimensions of the L-shaped structures.

In certain embodiments of the method of manufacturing the packagestructure, the package structure further comprises a cage wall structurein the antenna structure, the cage wall surrounding the antenna. Incertain embodiments, the cage wall structure is electrically connectedto the L-shaped structure through a first ground plane layer of the corestructure. In certain embodiments, the cage wall structure includes aplurality of conductive grounded rings that extend vertically throughthe antenna structure. The cage wall structure (or grounded cage wall)may enable enhanced antenna performance in many high precision packageprocesses.

It should be noted that the exemplary embodiments are described withreference to different subject-matters. In particular, some embodimentsare described with reference to method type claims whereas otherembodiments have been described with reference to apparatus type claims.However, a person skilled in the art will gather from the above and thefollowing description that, unless otherwise notified, in addition toany combination of features belonging to one type of subject-matter,also any combination between features relating to differentsubject-matters, in particular, between features of the method typeclaims, and features of the apparatus type claims, is considered as tobe described within this document.

These and other features and advantages will become apparent from thefollowing detailed description of illustrative embodiments thereof,which is to be read in connection with the accompanying drawings.

The above summary is not intended to describe each illustratedembodiment or every implementation of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings included in the present application are incorporated into,and form part of, the specification. They illustrate embodiments of thepresent disclosure and, along with the description, explain theprinciples of the disclosure. The drawings are only illustrative ofcertain embodiments and do not limit the disclosure.

FIG. 1 is a schematic cross-sectional side view of an example of awireless communications package, in accordance with certain embodiments.

FIG. 2 is a schematic plan view of the wireless communications packageof FIG. 1 , in accordance with certain embodiments.

FIG. 3 is perspective view of the wireless communications package ofFIG. 1 , in accordance with certain embodiments.

FIG. 4 is a schematic plan view of the wireless communications packageof FIG. 1 showing illustrating certain principles of operation of thedevice, in accordance with certain embodiments.

FIG. 5 is a schematic plan view of an array of the wirelesscommunications packages of FIG. 1 , in accordance with certainembodiments.

FIG. 6 is a graph depicting antenna impedance matching and port couplingfor a wireless communications package, in accordance with certainembodiments.

FIG. 7 is a graph depicting antenna frequencies for several differentwireless communications packages, each having a different geometry, inaccordance with certain embodiments.

FIG. 8 is a schematic diagram illustrating a feedline design forimpedance matching and routing for a wireless communication package, inaccordance with certain embodiments.

DETAILED DESCRIPTION

Embodiments will now be discussed in further detail with regard towireless communications package structures and, in particular, totechniques for packaging antenna structures with semiconductor RFICchips to form compact integrated radio/wireless communications systemswith high-performance integrated antenna systems (e.g., phased arrayantenna system).

The present embodiments provide antenna array in package implementationsfor the magneto-electric dipole (MED) antenna. The present embodimentsmay also include one or more of the following features: an L-shapedpatch structure for antenna performance and tunability; a cavity for theantenna to reduce antenna coupling and manufacturability; and an antennafeed line technique for antenna impedance matching and feed lineroutine, which may be helpful for array applications

The phased array antenna design of the present embodiments may be basedon the magneto-electric dipole (MED) antenna concept. These embodimentsmay improve antenna performance such as having a wide bandwidth, highport isolation, and stable gain. The present embodiments may beespecially suitable for Antenna-in-Package (AiP) applications that fullyutilize the package environment. The present embodiments may be used inhigh performance and low cost phased arrays in a package environment.

It is to be understood that the various layers and/or components shownin the accompanying drawings are not drawn to scale, and that one ormore layers and/or components of a type commonly used in constructingwireless communications packages with integrated antennas and RFIC chipsmay not be explicitly shown in a given drawing. This does not imply thatthe layers and/or components not explicitly shown are omitted from theactual package structures. Moreover, the same or similar referencenumbers used throughout the drawings are used to denote the same orsimilar features, elements, or structures, and thus, a detailedexplanation of the same or similar features, elements, or structureswill not be repeated for each of the drawings.

FIG. 1 is a schematic cross-sectional side view of a wirelesscommunications package 100 according to certain embodiments. Thewireless communications package 100 comprises an RFIC chip 102, and anantenna package 110 coupled to the RFIC chip 102. The antenna package110 comprises a multilayer package substrate comprising a central corelayer 120, an interface layer 130, and an antenna layer 140.

The RFIC chip 102 comprises a metallization pattern (not specificallyshown) formed on an active surface (front side) of the RFIC chip 102,which metallization pattern includes a plurality of bonding/contact padssuch as, for example, ground pads, DC power supply pads, input/outputpads, control signal pads, associated wiring, etc., that are formed aspart of a BEOL (back end of line) wiring structure of the RFIC chip 102.The RFIC chip 102 is electrically and mechanically connected to theantenna package 110 by flip-chip mounting the active (front side)surface of the RFIC chip 102 to a second side (e.g., bottom side) of theantenna package 110 using, for example, an array of solder ballcontrolled collapse chip connections (C4) (not shown), or other knowntechniques. Depending on the application, the RFIC chip 102 comprisesRFIC circuitry and electronic components formed on the active sideincluding, for example, a receiver, a transmitter or a transceivercircuit, and other active or passive circuit elements that are commonlyused to implement wireless RFIC chips. In certain embodiments, the RFICchip 102 comprises a semiconductor substrate having an active surfaceand an inactive surface, and a BEOL (back end of line) structure formedon the active surface of the semiconductor substrate, wherein the RFICchip is mounted to the package structure by connecting the BEOLstructure of the RFIC chip to contact pads (not shown) of the interfacestructure.

In certain embodiments, as shown in FIG. 1 , the antenna package 110comprises a multilayer structure that can be constructed using knownfabrication technologies such as SLC (surface laminar circuit), HDI(high density interconnect), or other fabrication techniques, whichenable the formation of organic-based multilayered circuit boards withhigh integration density. Using these circuit board fabricationtechniques, the antenna package 110 can be formed from a stack oflaminated layers comprising alternating layers of metallization anddielectric/insulator materials, wherein the metallization layers areseparated from overlying and/or underlying metallization layers by arespective layer of dielectric/insulating material. The metallizationlayers can be formed of copper and the dielectric/insulating layers canbe formed of an industry standard FR4 insulating material comprised offiberglass epoxy material. Other types of materials can be used for themetallization and insulating layers. Moreover, these technologies enablethe formation of small conductive vias (e.g., partial or buried viasbetween adjacent metallization layers) using laser ablation, photoimaging, etching, or plating, for example, to enable the formation ofhigh density wiring and interconnect structures within the antennapackage 110.

In the embodiment of FIG. 1 , the central core layer 120 provides astructurally sturdy layer upon which to build the interface layer 130and the antenna layer 140 on opposite sides of the core layer 120. Incertain examples, the core layer 120 may have a thickness of about500-1,000 μm. In one embodiment, the core layer 120 comprises asubstrate layer 122 having a first ground plane (i.e., metallizationlayer BC1, where BC may refer to a back conductor or a bottom conductor)formed on a bottom side of the substrate layer 122, and a second groundplane FC1 (where FC may refer to a front conductor) formed on a top sideof the substrate layer 122. The substrate layer 122 can be formed ofstandard FR4 material, or other standard materials that are typicallyused to construct a standard printed circuit board. The substrate layer122 can be formed with other materials having mechanical and electricalproperties that are similar to FR4, providing a relatively rigidsubstrate structure that provides structural support for the antennapackage 110.

The interface layer 130 comprises a plurality of laminated layers L1,L2, L3, L4, L5, L6, wherein each laminated layer L1, L2, L3, L4, L5, L6comprises a respective patterned metallization layer BC2, BC3, BC4, BC5,BC6 and BC7 formed on a respective dielectric/insulating layer D1, D2,D3, D4, D5, D6. In certain embodiments, metallization layer BC1 is anantenna ground plane, metallization layer BC3 is a ground plane,metallization layer BC4 is a power layer, metallization layer BC5 is alow frequency (or low F) layer, and metallization layer BC6 is a groundplane. The various metallization layers may be comprised of, forexample, Cu. Similarly, the antenna layer 140 comprises a plurality oflaminated layers L1, L2, L3, L4, L5, L6, wherein each laminated layerL1, L2, L3, L4, L5, L6 comprises a respective patterned metallizationlayer FC2, FC3, FC4, FC5, FC6 and FC7 (where FC may refer to a frontconductor) formed on a respective dielectric/insulating layer D1, D2,D3, D4, D5, D6, which form various components in the antenna layer 140.As also shown in FIG. 1 , the metallization layer FC7 corresponds to aV-polarization feed, and the FC5 layer corresponds to a H-polarizationfeed. The metallization layer FC6 includes the antenna structure (i.e.,the L-shaped structures 115 that are described in further detail below).In certain embodiments, for the buildup layers in the interface layer130 and the antenna layer 140, metal plating may be used in the surfacelaminar circuit (SLC) process.

As noted above, in one embodiment, the laminated layers L1, L2, L3, L4,L5, L6 of the interface and antenna layers 130 and 140 can be formedusing state of the art fabrication techniques such as SLC or similartechnologies, which can meet the requisite tolerances and design rulesneeded for high-frequency applications such as millimeter-waveapplications. With an SLC process, each of the laminated layers areseparately formed with a patterned metallization layer, wherein thefirst layers L1 of the interface and antenna layers 130 and 140 arebonded to the core layer 120, and wherein the remaining laminated layersL2, L3, L4, L5 and L6 (of the respective interface and antenna layers130 and 140) are sequentially bonded together using any suitable bondingtechnique, e.g., using an adhesive or epoxy material. In certainembodiments, regular PCB processes may be used where bonding materialsare used. However, for SLC, HDI and LTCC, bonding materials are notused. In these situations, the laminate/dielectric is stuck togetherunder heat/pressure directly.

As further shown in FIG. 1 , conductive vias are formed through the corelayer 120 and through the dielectric/insulating layers D1, D2, D3, D4,D5, D6 of the interface and antenna layers 130 and 140. The conductivevias that are formed through a given dielectric/insulating layer areconnected to via pads that are pattered from the metallization layersdisposed on each side of the given dielectric/insulating layer. Incertain examples, a thickness of the metallization layers FC1 and BC1may be about 36 μm or any other suitable thickness. In certain examples,a thickness of the metallization layers FC2, FC3 and FC4 may be, forexample, about 15 μm or any other suitable thickness.

The various metallization layers BC1, BC2, BC3, BC4, BC5, BC6, BC7, FC1,FC2, FC3, FC4, FC5, FC6, and FC7 and vertical conductive vias arepatterned and interconnected within and through the various layers (corelayer 120, interface layer 130, and antenna layer 140) of the antennapackage 110 to implement various features which are needed for a targetwireless communications application. Such features include, for example,antenna feed lines, ground planes, RF shielding and isolationstructures, power planes for routing supply power to the RFIC chip 102(and other RFICs or chips that may be included in the wirelesscommunications package 100), signal lines for routing IF (intermediatefrequency) signals, LO (local oscillator) signals, other low frequencyI/O (input/output) baseband signals, etc.

In particular, as shown in the example embodiment of FIG. 1 , theantenna package 110 comprises a first antenna feed line 112 (denoted bydashed line) and a second antenna feed line (denoted by dashed line114), which are routed through the interface layer 130, the core layer120, and the antenna layer 140. The first and second antenna feed lines112 and 114 comprise a series of interconnected metallic traces andconductive vias which are part of the metallization and dielectriclayers of the interface layer 130, the core layer 120, and the antennalayer 140 of the antenna package 110. As shown in FIG. 1 , the first andsecond antenna feed lines 112 and 114 are placed in between the L-shapedstructures 115 (to be discussed in further detail below). Moreover, thefirst and second antenna feed lines 112 and 114 have no connection tothe L-shaped structures 115 or the grounded cage walls 116 (to bediscussed in further detail below).

In one embodiment, the first and second antenna feed lines 112 and 114(as well as all other antenna feed lines formed within the antennapackage 110) are designed to have equalized lengths to optimize antennaoperation. For example, for phased array implementations, forming allantenna feed lines within the antenna package 110 to have the same orsubstantially the same length facilitates phase adjustment of RF signalsthat are fed to the patch antenna elements of the antenna array,prevents phased array beam squint, reduces angle scan error, andeffectively increases the bandwidth of operation of the antennaelements.

In the example embodiment of FIG. 1 , the length of the verticalportions of the antenna feed lines 112 and 114 which vertically extendthough interface layer 130, the core layer 120, and the antenna layer140, are fixed in length based on the thickness of the various layers ofthe antenna package 110. However, depending on the horizontal/lateralposition of the L-shaped structures 115 of the antenna array relative tothe corresponding antenna feed line ports (i.e., the V-port 105 and theH-port 107) of the RFIC chip 102, the lateral distance between the patchantenna elements and the RFIC chip 102 will vary. In this regard, toensure that each antenna feed line has the same length (or substantiallythe same length) overall, in one embodiment, a lateral routing of theantenna feed lines 112 and 114 within the antenna package 110 isimplemented with transmission lines formed in the same metallizationlayer of the multilayer package substrate. For example, in theembodiment shown in FIG. 1 , the lengths of the antenna feed lines 112and 114 are adjusted in the first layer L1 of the interface layer 130 byextending or shortening the routing of the lateral portions of theantenna feed lines 112 and 114 patterned from the metallization layerBC2 of the interface layer 130.

More specifically, in the embodiment of FIG. 1 , horizontal portions112-2 and 114-2 of the first and second antenna feed lines 112 and 114are patterned from the first metallization layer BC2 of the interfacelayer 130. The lengths of the horizontal portions 112-2 and 114-2 of thefirst and second antenna feed lines 112 and 114 are either extended orshortened to compensate for the difference in the lateral and/orvertical position of the other portions of the antenna feed lines 112and 114 which are routed through the interface layer 130, the core layer120 and antenna layer 140.

The interface layer 130 comprises wiring to distribute power to the RFICchip 102 and to route signals between two or more RFIC chips that areflip-chip mounted to the antenna package 110. For example, in oneembodiment, the metallization layers BC4 and BC5 of the interface layer130 serve as power planes to distribute power supply voltage to the RFICchip 102 from an application board (not shown) using horizontal tracesthat are patterned on the metallization layers BC4 and BC5, and verticalvia structures that are formed through the layers L4, L5, and L6 toconnect the power plane metallization to contact pads on the RFIC chip102.

In certain embodiments, the metallization layer BC6 of the interfacelayer 130 is patterned to form signal lines (e.g., microstriptransmission lines) for transmitting control signals, baseband signals,and other low frequency signals between an application board and theRFIC chip 102 (or between multiple RFIC chips attached to the antennapackage 110). In this embodiment, the metallization layer BC7 of theinterface layer 130 can serve as a ground plane for the microstriptransmission lines of the metallization layer BC6.

It is to be further noted that in the example embodiment of FIG. 1 , theinterface layer 130 comprises ground planes that are used for purposesof providing shielding and to provide ground elements for microstrip orstripline transmission lines, for example, that are formed by horizontaltraces. For example, the metallization layer BC1 of the interface layer120 comprises ground planes that serve as RF shields to shield the RFICchip 102 from exposure to incident electromagnetic radiation (EM)captured by the patch antennas.

Moreover, the ground planes of the metallization layer BC1 of theinterface layer 130 are configured to, e.g., (i) provide shieldingbetween horizontal signal line traces formed in adjacent metallizationlayers, (ii) serve as ground planes for microstrip or striplinetransmission lines, for example, that are formed by the horizontalsignal line traces, and (iii) provide grounding for vertical shieldstructures 133 that are formed by a series of vertically connectedgrounded vias, which are formed through layers L3 to L6 betweenmetallization layers BC3 and BC7, and which surround portions of theantenna feed lines 112 and 114 (e.g., vertical portions of antenna feedlines 112 and 114 adjacent to the vertical shield structures 133)extending through the interface layer 130, for example. For very highfrequency applications, the implementation of stripline transmissionlines and ground shielding may help to reduce interference effects ofother package components such as the power plane(s), low frequencycontrol signal lines, and other transmission lines.

In the example embodiment of FIG. 1 , a combination of the verticalshield structures 133 and the vertical portions of the antenna feedlines 112 and 114 adjacent to the vertical shield structures 133 (i.e.,in the interface layer 130) essentially form a transmission linestructure that is similar to a coaxial transmission line, wherein thesurrounding vertical shield structures 133 serve as an outer (shielding)conductor, and the vertical portions (i.e., the antenna feed lines 112or 114) serve as a center (signal) conductor. Coaxial transmission lineconfigurations can be implemented for other vertical portions of theantenna feed lines 112 and 114 which extend through the core layer 120and the antenna layer 140, as schematically illustrated in FIG. 1 .

Moreover, metallization layer BC7 of the interface layer 130 serves as aground plane to isolate the antenna package 110 from the RFIC chip 102for enhanced EM shielding. The metallization layer BC7 of the interfacelayer 130 comprises via openings to provide contact ports forconnections between the RFIC chip 102 and package feed lines, signallines and power lines of the antenna package 110.

As also shown in FIG. 1 , the antenna layer 140 includes a grounded cagewall 116 that extends vertically through layers L1 to L6 of the antennalayer 140. The grounded cage wall 116 surrounds the L-shaped structures115 and is connected to the L-shaped structures 115 through themetallization layer BC1 of the core layer 120. Thus, the L-shapedstructures 115 are grounded planar structures that are not electricallyconnected to the antenna feed lines 112 and 114. Pillars 113 alsoconnect the L-shaped structures 115 to ground. The pillars 113 extenddownward from the bottom surface of the L-shaped structures 115 down tothe metallization layer BC1 of the core layer 120 through layers L5-L1and through the substrate layer 122. In one example, the pillars 113have a vertical length of about λ/4.

Referring now to FIG. 2 , this figure shows a schematic plan view of thewireless communications package of FIG. 1 , in accordance with certainembodiments. As shown in FIG. 2 , the grounded cage wall 116 surroundsthe entire perimeter of the wireless communications package 100. Incertain embodiments, the structural elements of the grounded cage wall116 have a semicircular shape (i.e., a half circle when viewed in planview). Thus, as will be described in detail hereinafter, this enables aplurality of the wireless communications packages 100 to be combinedinto an array, and then the semicircular structural elements of thegrounded cage wall 116 of adjacent packages to meet at the edges of thewireless communications package 100 to form a full circular structure.

As shown in FIG. 2 , the wireless communications package 100 includes anantenna structure that includes a plurality of the L-shaped structures115. In this example, there are four L-shaped structures 115, where thecorners of each of the L-shaped structures 115 point in toward themiddle of the wireless communication package 100. As discussed abovewith respect to FIG. 1 , the pillars 113 (in this example, there arefive pillars 113 associated with each L-shaped structure 115, althoughthere may be any suitable number) extend downward from the bottomsurface of the L-shaped structures 115 to the first ground plane (i.e.,metallization layer BC1). As such, the pillars 113 and the metallizationlayer BC1 connect the L-shaped structures 115 to the grounded cage wall116.

As shown in FIG. 2 , the wireless communications package 100 includes anH-port 107 that connects to the H feed line (i.e., the second antennafeed line 114 as shown in FIG. 1 ) at the metallization layer BC7. Thehorizontal portion 114-2 of the second antenna feed line 114 is showntraversing from the H-port 107 to the center of the wirelesscommunications package 100 (i.e., a central portion between the fourL-shaped structures 115) at the level of the metallization layer BC2. Atthe end of the horizontal portion 114-2 of the second antenna feed line114 closest to the center of the wireless communication package 100 isan H-structure 136 that extends vertically (as shown in thecross-section of FIG. 1 ) from the metallization layer BC2 to themetallization layer FC6. This is an area where a signal to the antennais applied. For the second antenna feed line 114, there are third andfourth portions of the metallization layer FC6-3 and FC6-4 that areconnected by an H-bridge 137. The H-bridge 137 is formed atmetallization layer FC5.

As also shown in FIG. 2 , the wireless communications package 100includes a V-port 105 that connects to the V feed line (i.e., the firstantenna feed line 112 as shown in FIG. 1 ) at the metallization layerBC7. The horizontal portion 112-2 of the first antenna feed line 112 isshown traversing from the V-port 105 to the center of the wirelesscommunications package 100 at the level of the metallization layer BC2.At the end of the horizontal portion 112-2 of the first antenna feedline 112 closest to the center of the wireless communication package 100is a V-structure 134 that extends vertically (as shown in thecross-section of FIG. 1 ) from the metallization layer BC2 to themetallization layer FC6. This is also an area where an antenna signal isapplied. For the first antenna feed line 112, there are first and secondportions of the metallization layer FC6-1 and FC6-2 that are connectedby a V-bridge 135. The V-bridge 135 (or a second bridge) is formed atmetallization layer FC7. It should be appreciated that because theV-bridge 135 is formed at metallization layer FC7 and the H-bridge 137(or a first bridge) is formed at metallization layer FC5 that they aredifferent heights. Thus, when they cross in the middle of the wirelesscommunications package (i.e., in the plan view of FIG. 2 ) they do notcontact each other. In other words, the V-bridge 135 crosses over theH-bridge 137. In particular, for the V-bridge 135 to avoid crossingbridges (i.e., for avoiding H and V feeds crossing each other on FC6layer), the H-bridge 137 has a section on metallization layer FC6, goesdown to metallization layer FC5 for a section, then goes up tometallization layer FC6 for another section. The V-bridge 135 hassection on metallization layer FC6, goes up to metallization layer FC7for a section, then goes down to metallization layer FC6 for anothersection. Moreover, it should also be appreciated that the L-shapedstructures 115 are at the same metallization layer level (i.e.,metallization layer FC6) as the first, second, third and fourth portionsof the metallization layer FC6-1, FC6-2, FC6-3, and FC6-4.

Referring now to FIG. 3 , this figure shows a schematic plan view of thewireless communications package of FIG. 1 , in accordance with certainembodiments. The elements in FIG. 3 correspond to like elements in FIG.2 , and thus the description of same will not be repeated herein.However, as shown in FIG. 3 , in certain examples, the conductiveportions of the grounded cage wall 116 in the central core layer 120 mayhave a larger diameter than the portions in the antenna layer 140. Also,the number of conductive portions of the grounded cage wall 116 in theantenna layer 140 may be greater than the number of conductive portionsin the core layer 120, as shown in FIG. 3 . This feature can also beseen in the plan view of FIG. 2 . It should be appreciated however thanany other suitable diameter or number of conductive portions may be usedfor the grounded cage wall 116.

Referring now to FIG. 4 , this figure shows a schematic plan view of thewireless communications package 100 of FIG. 1 showing illustratingcertain principles of operation of the device, in accordance withcertain embodiments. As shown in FIG. 4 , depending on the dimensions,the antenna structure can have one or two resonant frequencies. In thecase of two resonant frequencies, the high resonant frequency isprimarily determined by the height or the vertical distance betweenmetallization layer FC6 and metallization layer BC1 and the substratelayer 122 and buildup layer dielectric constants. The low resonantfrequency is determined by the parameters of PWxc (i.e., a distancebetween a third side 115-3 and a fourth side 115-4 of the L-shapedstructure 115) and PWyc (i.e., a distance between a first side 115-1 anda second side 115-2 of the L-shaped structure 115) (assuming PWx and Pwyare fixed). Decreasing the values of these parameters will decrease thelow resonant frequency. It also pushes the high resonant frequency alittle bit higher. As a result, the antenna bandwidth widens.

The low resonant frequency is also determined by the parameters of PWx(i.e., a distance between a sixth side 115-6 and a fourth side 115-4 ofthe L-shaped structure 115) and Pwy (i.e., a distance between a fifthside 115-5 and a second side 115-2 of the L-shaped structure 115).Increasing the values of these parameters will decrease the low resonantfrequency. It also pushes the high resonant frequency a little bitlower. Another geometrical parameter that may exist is portHF, which isshown in FIG. 4 . Another geometrical parameter than may exist is theRing Width, which is indicated on FIG. 4 , which represents the width ofthe grounded cage wall 116 zone.

Bandwidth and impedance match may also need to be optimized by changingone or more of the parameters (i.e., PWx, PWy, PWyc, PWxc, portHF, andthe Ring Width) shown in FIG. 4 . The reflection coefficient curves(see, FIG. 6 , S11 and S22) have a “W” shape. Widening the bandwidthimplies that the center tip of the “W” moves up. The grounded ring widthRW of the pillars 113 may also affect the antenna performance it is toowide. The grounded ring of the pillars 113 not only can enhance antennaperformance but may also be required in certain high precision packageprocesses. Therefore, the grounded ring of the pillars 113 may also beconsidered to be a part of the antenna structure of the wirelesscommunication package 100, according to certain embodiments.

Referring now to FIG. 5 , this figure is a schematic plan view of anarray of the wireless communications packages 100 of FIG. 1 , inaccordance with certain embodiments. In this example, there is atwo-by-two array of wireless communications packages 100-1, 100-2, 100-3and 100-4. As discussed briefly above with respect to FIG. 2 , incertain embodiments, the structural elements of the grounded cage wall116 have a semicircular shape (i.e., a half circle when viewed in planview). Thus, this enables a plurality of the wireless communicationspackages 100-1, 100-2, 100-3 and 100-4 to be combined into an array, andthen the semicircular structural elements of the grounded cage wall 116of adjacent packages to meet at the edges of the wireless communicationspackage 100 to form a full circular structure. As such, the groundedcage walls 116 (or grounded cage structures) may be abutted to eachother. The effects of this may include: (1) the grounded cage walls 116may help to satisfy metal density requirements; (2) it may provideisolation between the antenna structures of the different wirelesscommunication packages 100-1, 100-2, 100-3 and 100-4; and (3) it mayhelp with scalability. Although a two-by-two array is shown with respectto FIG. 5 , it should be appreciated that any suitably sized array maybe used (e.g., and eight-by-eight array of sixty four antennas). Incertain examples, the spacing between respective centers of differentantennas in the array of adjacent wireless communication packages 100may be a λ/2 wavelength. It should also be appreciated that theunderlying RFIC chip 102 is shown to correspond with one of the wirelesscommunications packages (e.g., as shown in FIG. 1 ). It should also beappreciated that the grounded cage walls 116 may help in isolating theantennas in different wireless communications packages 100 in the array.The grounded cage walls 116 may also aide in the manufacturing process,and they may reduce antenna bandwidth and detune the impedance matching.Also, by adjusting the dimensions of the L-shaped structures 115, theantenna bandwidth and impedance matching may also be improved.

FIG. 6 is a graph depicting antenna impedance matching and port couplingfor a wireless communications package, in accordance with certainembodiments. As discussed above, the antenna bandwidth and impedancematch may also need to be optimized by changing one or more of theparameters (i.e., PWx, PWy, PWyc, PWxc, portHF, and the Ring Width)shown in FIG. 4 . The reflection coefficient curves (see, FIG. 6 , S11and S22) have a “W” shape. Widening the bandwidth implies that thecenter tip of the “W” moves up. In certain examples, the layout of theL-shaped structures 115 is in a symmetrical configuration, where thedimensions of PSy and PSx are the same, where the dimensions of PWyc andPWxc are the same, and where the dimensions of PWy and PWx are the same.

FIG. 7 is a graph depicting antenna frequencies for several differentwireless communications packages 100, each having a different geometry,in accordance with certain embodiments. In particular, FIG. 7 shows asimulated performance comparison when the geometry of the L-shapedstructures 115 discussed herein are changed between the actual L-shapeshown in FIG. 2 to more of standard square shaped patch. If PWxc=PWyc=0,the L-shaped structures become square patches (see also, FIG. 4 ).Reducing PWxc and PWyc will widen the antenna bandwidth (moving the tworesonant frequencies apart). Changing PWx and PWy could also move thetwo resonant frequencies. In certain embodiments, by adjusting PWx, PWy,PWxc, and PWyc, antenna performance can be optimized. Moreover, changingthe PWxc and PWyc parameters may provide additional design freedom. Asshown in FIG. 7 , the curves PWxc=PWyc=0.55 mm and PWxc=PWyc=0.90 mmhave a “W” shape, that allows for two resonant frequencies. Also, withthese two curves having the “W” shape, it can be seen that curvePWxc=PWyc=0.90 mm has a narrower bandwidth (i.e., the horizontaldistance between the two bottom points of the “W”) than curvePWxc=PWyc=0.55 mm. Thus, it can be seen that the antenna performancecharacteristics may be tuned or optimized by changing the physicaldimensions of the L-shaped structures 115.

FIG. 8 is a schematic diagram illustrating a feedline design forimpedance matching and routing for a wireless communication package, inaccordance with certain embodiments. In general, antenna impedance atthe bottom of the antenna ground plane at metallization layer BC1 is notmatched to the RFIC transceiver impedance ZL (typically 50 ohm) atmetallization layer BC7. The vertical transition from metallizationlayer BC7 to metallization layer BC3 will transform impedance from ZL toZ1. In the array design, antennas will have difference distances to thetransceiver ports. Since antenna feed lines need to routine in theantenna package design, it may be needed to set Z1=Zs, so that changingthe routing line length will not affect the impedance at the transceiverports. In the case that adjusting the length and width of line sectionwith impedance Z3 cannot ensure that Zs=Z2, a quarter wavelengthtransformer with line impedance Zt may be required.

Those of ordinary skill in the art will readily appreciate the variouseffect associated with integrated chip/antenna package structuresaccording to the present embodiments. For instance, the packagestructure can be readily fabricated using known manufacturing andpackaging techniques to fabricate and package antenna structures withsemiconductor RFIC chips to form compact integrated radio/wirelesscommunications systems that are configured to operate at millimeter-wavefrequencies and higher. Moreover, integrated chip packages according toembodiments enable antennas to be integrally packaged with IC chips suchas transceiver chips, which provide compact designs with very low lossbetween the transceiver and the antenna. Moreover, the use of integratedantenna/IC chip packages according to embodiments as discussed hereinsaves significant space, size, cost, and weight, which is a premium forvirtually any commercial or military application.

It is to be understood that the present embodiments will be described interms of a given illustrative architecture; however, otherarchitectures, structures, substrate materials and process steps/blockscan be varied within the scope of the present disclosure. It should benoted that certain features cannot be shown in all figures for the sakeof clarity. This is not intended to be interpreted as a limitation ofany particular embodiment, or illustration, or scope of the claims.

It will also be understood that when an element such as a layer, regionor substrate is referred to as being “on” or “over” another element, itcan be directly on the other element or intervening elements can also bepresent. In contrast, when an element is referred to as being “directlyon” or “directly over” another element, there are no interveningelements present. It will also be understood that when an element isreferred to as being “connected” or “coupled” to another element, it canbe directly connected or coupled to the other element or interveningelements can be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present.

Reference in the specification to “one embodiment” or “an embodiment”,as well as other variations thereof, means that a particular feature,structure, characteristic, and so forth described in connection with theembodiment is included in at least one embodiment. Thus, the appearancesof the phrase “in one embodiment” or “in an embodiment”, as well anyother variations, appearing in various places throughout thespecification are not necessarily all referring to the same embodiment.

It is to be appreciated that the use of any of the following “/”,“and/or”, and “at least one of”, for example, in the cases of “A/B”, “Aand/or B” and “at least one of A and B”, is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of both options (A andB). As a further example, in the cases of “A, B, and/or C” and “at leastone of A, B, and C”, such phrasing is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of the third listedoption (C) only, or the selection of the first and the second listedoptions (A and B) only, or the selection of the first and third listedoptions (A and C) only, or the selection of the second and third listedoptions (B and C) only, or the selection of all three options (A and Band C). This can be extended, as readily apparent by one of ordinaryskill in this and related arts, for as many items listed.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “includes” and/or “including,” when usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, can be used herein for ease of description todescribe one element's or feature's relationship to another element(s)or feature(s) as illustrated in the FIG. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the FIGS. For example, if the device in theFIGS. is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device can be otherwise oriented (rotated 90degrees or at other orientations), and the spatially relativedescriptors used herein can be interpreted accordingly. In addition, itwill also be understood that when a layer is referred to as being“between” two layers, it can be the only layer between the two layers,or one or more intervening layers can also be present.

It will be understood that, although the terms first, second, etc. canbe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another element. Thus, a first element discussed belowcould be termed a second element without departing from the scope of thepresent concept.

The descriptions of the various embodiments have been presented forpurposes of illustration and are not intended to be exhaustive orlimited to the embodiments disclosed. Many modifications and variationswill be apparent to those of ordinary skill in the art without departingfrom the scope and spirit of the described embodiments. The terminologyused herein was chosen to best explain the principles of theembodiments, the practical application or technical improvement overtechnologies found in the marketplace, or to enable others of ordinaryskill in the art to understand the embodiments disclosed herein.

What is claimed is:
 1. A package structure, comprising: a planar corestructure comprising a first side and a second side opposite the firstside; an antenna structure disposed on the first side of the planar corestructure, the antenna structure comprising a plurality of firstlaminated layers, each first laminated layer comprising a firstpatterned conductive layer formed on a first insulating layer, anantenna formed on one or more first patterned conductive layers of thefirst laminated layers, the antenna including at least one L-shapedstructure as viewed in a plan view; an interface structure disposed onthe second side of the planar core structure; and an antenna feed linestructure formed in, and routed through, the interface structure and theplanar core structure, wherein the antenna feed line structure is notconnected to the antenna.
 2. The package structure of claim 1, whereinthe planar core structure comprises a core substrate formed of aninsulating material.
 3. The package structure of claim 1, wherein theinterface structure comprises a plurality of second laminated layers,each second laminated layer comprising a second patterned conductivelayer formed on a second insulating layer.
 4. The package structure ofclaim 1, wherein the interface structure comprises a plurality of secondlaminated layers, each second laminated layer including a secondpatterned conductive layer formed on a second insulating layer, andwherein a power plane, a ground plane, signal lines, and contact padsare formed on one or more patterned second conductive layers of theplurality of second laminated layers of the interface structure.
 5. Thepackage structure of claim 1, wherein the antenna includes four of theL-shaped structures.
 6. The package structure of claim 5, wherein theL-shaped structures are arranged in a symmetrical manner with corners ofthe L-shaped structures facing inward.
 7. The package structure of claim1, further comprising a cage wall structure in the antenna structure,the cage wall surrounding the antenna.
 8. The package structure of claim7, wherein the cage wall structure is electrically connected to theL-shaped structure through a first ground plane layer of the corestructure.
 9. The package structure of claim 7, wherein the cage wallstructure includes a plurality of conductive grounded rings that extendvertically through the antenna structure.
 10. The package structure ofclaim 1, further comprising: a first antenna feed line structure and asecond antenna feed line structure; a first bridge formed on one of theone or more first patterned conductive layers and connected to the firstantenna feed line structure; and a second bridge formed on a differentone of the one or more first patterned conductive layers and connectedto the second antenna feed line structure, wherein the first bridge andsecond bridge cross each other in a central portion of the packagestructure.
 11. An apparatus, comprising: a package structure comprisinga planar core structure comprising a first side and a second sideopposite the first side, an antenna structure disposed on the first sideof the planar core structure, the antenna structure comprising aplurality of first laminated layers, each first laminated layercomprising a first patterned conductive layer formed on a firstinsulating layer, an antenna formed on one or more first patternedconductive layers of the first laminated layers, the antenna includingat least one L-shaped structure as viewed in a plan view, an interfacestructure disposed on the second side of the planar core structure, andan antenna feed line structure formed in, and routed through, theinterface structure and the planar core structure, wherein the antennafeed line structure is not connected to the antenna; and an RFIC (radiofrequency integrated circuit) chip comprising a semiconductor substratehaving an active surface and an inactive surface, and a BEOL (back endof line) structure formed on the active surface of the semiconductorsubstrate, wherein the RFIC chip is mounted to the package structure byconnecting the BEOL structure of the RFIC chip to contact pads of theinterface structure.
 12. The apparatus of claim 11, wherein the planarcore structure comprises a core substrate formed of an insulatingmaterial.
 13. The apparatus of claim 11, wherein the interface structurecomprises a plurality of second laminated layers, each second laminatedlayer comprising a second patterned conductive layer formed on a secondinsulating layer.
 14. The apparatus of claim 11, wherein the interfacestructure comprises a plurality of second laminated layers, each secondlaminated layer including a second patterned conductive layer formed ona second insulating layer, and wherein a power plane, a ground plane,signal lines, and contact pads are formed on one or more patternedsecond conductive layers of the plurality of second laminated layers ofthe interface structure.
 15. The apparatus of claim 11, wherein theantenna includes four of the L-shaped structures.
 16. The apparatus ofclaim 15, wherein the L-shaped structures are arranged in a symmetricalmanner with corners of the L-shaped structures facing inward.
 17. Theapparatus of claim 11, further comprising a cage wall structure in theantenna structure, the cage wall surrounding the antenna.
 18. Theapparatus of claim 17, wherein the cage wall structure is electricallyconnected to the L-shaped structure through a first ground plane layerof the core structure.
 19. The apparatus of claim 17, wherein the cagewall structure includes a plurality of conductive grounded rings thatextend vertically through the antenna structure.
 20. The apparatus ofclaim 11, further comprising: a first antenna feed line structure and asecond antenna feed line structure; a first bridge formed on one of theone or more first patterned conductive layers and connected to the firstantenna feed line structure; and a second bridge formed on a differentone of the one or more first patterned conductive layers and connectedto the second antenna feed line structure, wherein the first bridge andsecond bridge cross each other in a central portion of the packagestructure.
 21. A method of manufacturing a package structure, the methodcomprising: forming a planar core structure comprising a first side anda second side opposite the first side; forming an antenna structure onthe first side of the planar core structure, the antenna structurecomprising a plurality of first laminated layers, each first laminatedlayer comprising a first patterned conductive layer formed on a firstinsulating layer, an antenna formed on one or more first patternedconductive layers of the first laminated layers, the antenna includingat least one L-shaped structure as viewed in a plan view; forming aninterface structure on the second side of the planar core structure; andforming an antenna feed line structure in, and routed through, theinterface structure and the planar core structure, wherein the antennafeed line structure is not connected to the antenna.
 22. The method ofclaim 21, wherein the antenna includes four of the L-shaped structures.23. The method of claim 22, wherein the L-shaped structures are arrangedin a symmetrical manner with corners of the L-shaped structures facinginward.
 24. The method of claim 21, further comprising forming a cagewall structure in the antenna structure, the cage wall surrounding theantenna.
 25. The method of claim 24, wherein the cage wall structure iselectrically connected to the L-shaped structure through a first groundplane layer of the core structure.